US Patent Issued to Shanghai Biren Technology on April 14 for "Chipset and method of manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,767, issued on April 14, was assigned to Shanghai Biren Technology Co. Ltd (Shanghai).

"Chipset and method of manufacturing the same" was invented by Shiqun Gu (Shanghai), Zhou Hong (Shanghai), Linglan Zhang (Shanghai), Zheng Tian (Shanghai), Hongying Zhang (Shanghai) and Peng Liu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a chipset and a manufacturing method thereof. The chipset includes a logic chip, an input/output chip, and an interposer. The logic chip includes a plurality of first bonding components disposed in the first device layer. The input/output chip includes a plurality of second bonding co...