US Patent Issued to SG MICRO on Aug. 25 for "Device module, manufacturing method therefor, and inductor-capacitor array" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,156, issued on Aug. 25, was assigned to SG MICRO CORP (Beijing).

"Device module, manufacturing method therefor, and inductor-capacitor array" was invented by Lei Tan (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device module includes first and second conductive layers, and first and second functional layers between the first and second conductive layers. The first functional layer includes a plurality of capacitors and a plurality of via electrodes isolated from the plurality of capacitors. A plurality of inductors are formed in the second functional layer, each arranged along a thickness direction of the second functional layer. Thus, ...