US Patent Issued to SERIPHY TECHNOLOGY on Oct. 6 for "Semiconductor package and method for manufacturing a semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,795, issued on Oct. 6, was assigned to SERIPHY TECHNOLOGY Corp. (Hsinchu County, Taiwan).

"Semiconductor package and method for manufacturing a semiconductor package" was invented by Tzu-Wei Chiu (Hsinchu County, Taiwan), Chun-Wei Chang (Taipei City, Taiwan), Wei-Chih Chen (Taoyuan City, Taiwan) and Che-Yen Huang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses a semiconductor package and a method for manufacturing the semiconductor package. The semiconductor package includes a first dielectric layer, a first redistribution layer (RDL) disposed on a first surface of the first dielectric layer, a...