US Patent Issued to SERIPHY TECHNOLOGY on June 9 for "Semiconductor structures and method for manufacturing a semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,049, issued on June 9, was assigned to SERIPHY TECHNOLOGY Corp. (Hsinchu County, Taiwan).

"Semiconductor structures and method for manufacturing a semiconductor structure" was invented by Tzu-Wei Chiu (Hsinchu County, Taiwan), Chun-Wei Chang (Taipei City, Taiwan), Shang-Pin Chen (Hsinchu County, Taiwan), Wei-Chih Chen (Taoyuan City, Taiwan) and Che-Yen Huang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses a semiconductor structure and methods for manufacturing semiconductor structures. The semiconductor structure includes a plurality of bottom dies and a top die stacked on the bottom dies. The ...