ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,779,749, issued on Nov. 3, was assigned to SEOYON E-HWA Co. LTD. (Anyang, South Korea).
"Apparatus and method for expanded polypropylene molding" was invented by Chi Won Yoon (Cheonan, South Korea) and Hyeok Lee (Siheung, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Proposed are an apparatus and a method for expanded polypropylene (EPP) molding. The apparatus for EPP molding includes an upper mold, a lower mold forming a cavity, which is a space for manufacturing a molded product, together with the upper mold, a skin holding means provided at the upper mold or the lower mold, an insert holding means provided at one of the upper mold and the...