US Patent Issued to SEOUL VIOSYS on Feb. 17 for "LED chip package and manufacturing method of the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,457, issued on Feb. 17, was assigned to SEOUL VIOSYS Co. LTD. (Ansan-si, South Korea).

"LED chip package and manufacturing method of the same" was invented by Jong Min Jang (Ansan-si, South Korea), Chang Yeon Kim (Ansan-si, South Korea) and Myoung Hak Yang (Ansan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting module including a substrate, a first light emitter, a second light emitter, and a third light emitter, in which at least two of the first, second, and third emitters are disposed one over another, connection electrodes electrically connected to at least one of the first, second, and third light emitters, a pass...