US Patent Issued to SENSYLINK MICROELECTRONICS on Sept. 8 for "Thermal management chip and system with built-in interface host, and management method" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,487, issued on Sept. 8, was assigned to SENSYLINK MICROELECTRONICS INC. (Shanghai).

"Thermal management chip and system with built-in interface host, and management method" was invented by Hui Zhang (Shanghai) and Yu Wang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal management chip and system with a built-in interface host, and a management method are provided. The thermal management chip includes a controllable current source sequence, a temperature sensing device category decision module, an analog-to-digital converter (ADC) module, a register bank & interface & control logic module, a non-volatile memory (NVM), a clock gener...