ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,728,470, issued on Sept. 8, was assigned to SENJU METAL INDUSTRY Co. LTD. (Tokyo).
"Jet soldering apparatus" was invented by Yasuji Kawashima (Tokyo), Hiroshi Taguchi (Tokyo), Kyoko Kuramoto (Tokyo), Henri Hanzawa (Tokyo), Tomotake Kagaya (Tokyo), Hirokazu Ichikawa (Tokyo) and Katsuhiro Shinohara (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A jet soldering apparatus 100 has a storage tank 110 configured to store molten solder; a supply port 125, 135 for supplying the molten solder to a substrate 200; and a cooling unit 310, 330 that is positioned on a downstream side of the supply port 125, 135 in a conveyance direction of the substrate 200, is...