ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,060, issued on March 24, was assigned to SENJU METAL INDUSTRY Co. LTD. (Tokyo).
"Solder alloy, solder ball and solder joint" was invented by Yuki Iijima (Tokyo), Shunsaku Yoshikawa (Tokyo), Kanta Dei (Tokyo), Takahiro Matsufuji (Tokyo) and Kota Sugisawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention employs a lead-free and antimony-free solder alloy which has an alloy composition that contains from 1.0% by mass to 4.0% by mass of Ag, from 0.1% by mass to 1.0% by mass of Cu, from 0.1% by mass to 9.0% by mass of Bi, from 0.005% by mass to 0.3% by mass of Ni and from 0.001% by mass to 0.015% by mass of Ge, with the balance...