US Patent Issued to Senju Metal Industry on March 17 for "Lead-free and antimony-free solder alloy, solder ball, and solder joint" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,463, issued on March 17, was assigned to Senju Metal Industry Co. Ltd. (Tokyo).

"Lead-free and antimony-free solder alloy, solder ball, and solder joint" was invented by Yuuki Iijima (Tokyo), Shunsaku Yoshikawa (Tokyo), Takashi Saito (Tokyo), Kanta Dei (Tokyo) and Takahiro Matsufuji (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint, which have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy has an alloy composition consisting of, by mass %, 0.1 to 4.5%...