US Patent Issued to SEMIGHT INSTRUMENTS on Sept. 22 for "Probe mounting structure and reliability test system for wafer-level reliability test" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,742,814, issued on Sept. 22, was assigned to SEMIGHT INSTRUMENTS Co. LTD (Suzhou, China).

"Probe mounting structure and reliability test system for wafer-level reliability test" was invented by Zhe Lian (Suzhou, China), Pengsong Xu (Suzhou, China), Shan Zhao (Suzhou, China), Xiaoming Guo (Suzhou, China) and Jianjun Huang (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A probe mounting structure and a wafer-level reliability test system are provided. The probe mounting structure includes a probe mounting plate. The probe mounting plate is provided with mounting holes penetrating through a thickness direction of the probe mounting plate. A ...