US Patent Issued to Semiconductor Manufacturing International (Shanghai), Semiconductor Manufacturing International (Beijing) on July 28 for "Packaging structure and packaging method" (Chinese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,779, issued on July 28, was assigned to Semiconductor Manufacturing International (Shanghai) Corp. (Shanghai) and Semiconductor Manufacturing International (Beijing) Corp. (Beijing).

"Packaging structure and packaging method" was invented by Jisong Jin (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure relates to a packaging structure and a packaging method. The packaging structure includes: a substrate; an interconnecting structure, bonded to the substrate, the interconnecting structure is electrically connected to the substrate; a chipset, including a plurality of first chips stacked along a longitudinal direction, the first ...