US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Oct. 6 for "Semiconductor packages with wettable flanks and related methods" (Malaysian, American Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,696, issued on Oct. 6, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor packages with wettable flanks and related methods" was invented by Nam Khong Then (Seremban, Malaysia), Hui Min Ler (Seremban, Malaysia), Phillip Celaya (Gilbert, Ariz.) and Chee Hiong Chew (Seremban, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a leadframe for a semiconductor package may include a half-etched gate lead directly coupled to a gate tie bar; a half-etched source lead directly coupled to a source tie bar; and a die flag directly coupled to at least two die flag tie bars. The gate tie bar and the...