US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Oct. 27 for "Fan out package for a semiconductor power module" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,960, issued on Oct. 27, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Fan out package for a semiconductor power module" was invented by Jihwan Kim (Seoul, South Korea), Seungwon Im (Bucheon, South Korea), Oseob Jeon (Seoul, South Korea), Hangil Shin (Incheon, South Korea) and Taekyun Kim (Bucheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fan out package may include a plurality of semiconductor dies, each of the semiconductor dies including a first surface and a second surface opposite to the first surface. The fan out package includes a redistribution layer coupled to the first surface of each of t...