US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on May 26 for "Discrete dual pads for a circuit" (Chinese, American Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,153, issued on May 26, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Discrete dual pads for a circuit" was invented by Jie Chang (Suzhou, China), XiaoYing Yuan (Suzhou, China), Keunhyuk Lee (Suzhou, China), Jerome Teysseyre (Scottsdale, Ariz.) and Leo Gu (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of high-power semiconductor device modules are described, including automotive power transistor assemblies for use in power amplifier circuits such as a cascode circuit. In some implementations, power amplifier circuit components are provided on separate semiconductor die attached to discrete...