US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on March 31 for "Power module package with stacked direct bonded metal substrates" (South Korean, Chinese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,736, issued on March 31, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Power module package with stacked direct bonded metal substrates" was invented by Jonghwan Baek (Bucheon, South Korea), Jeonghyuk Park (Incheon, South Korea), Seungwon Im (Seoul, South Korea), Keunhyuk Lee (Suzhou, China) and Dukyong Lee (Bucheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a first direct bonded metal (DBM) substrate, a first semiconductor die disposed on a top surface of the first DBM substrate, a second DBM substrate disposed at a height above the first DBM substrate, and a second semiconductor ...