US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on March 24 for "Methods of manufacturing semiconductor devices and semiconductor devices" (Czech, Null Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,445, issued on March 24, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Methods of manufacturing semiconductor devices and semiconductor devices" was invented by David Lysacek (Zasova, Czech Republic), Jan Hybl (Zubri, Czech Republic), Dusan Postulka (Ostrava, Czech Republic), Juraj Jarina (Rajec, Slovak Republic), Vit Janirek (Roznov pod Radhostem, Czech Republic) and Alexandra Senkova (Vetrkovice u Vitkova, Czech Republic).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an example, a method of manufacturing a semiconductor device includes providing a semiconductor substrate comprising an unpolished CZ silicon subst...