ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,307, issued on March 24, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).
"Image sensor with a bond pad" was invented by Marc Allen Sulfridge (Boise, Idaho), William Crofoot (Nampa, Idaho) and Swarnal Borthakur (Boise, Idaho).
According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor may include a sensor chip that is bonded to an application-specific integrated circuit (ASIC) chip. A bond pad for the image sensor may be formed in the ASIC chip and exposed through a trench in the sensor chip. The image sensor may include a conductive light shield at a periphery of the image sensor to shield optically black pixels. An o...