US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on June 30 for "Clips for semiconductor package and related methods" (South Korean, American, German Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,556, issued on June 30, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Clips for semiconductor package and related methods" was invented by Inpil Yoo (Unterhaching, Germany), Seungwon Im (Seoul, South Korea), JooYang Eom (Gimpo-si, South Korea) and Jerome Teysseyre (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a clip may include a first copper layer directly bonded to a first side of a ceramic layer, a second copper layer directly bonded to a second side of the ceramic layer, the second side of the ceramic layer opposite the first side of the ceramic layer, and a plurality of chan...