US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Aug. 11 for "Power modules and related methods" (American, Philippine, Malaysian Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,997, issued on Aug. 11, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Power modules and related methods" was invented by Jinchang Zhou (Scottsdale, Ariz.), Asif Jakwani (Scottsdale, Ariz.), Chee Hiong Chew (Seremban, Malaysia), Yusheng Lin (Phoenix), Sravan Vanaparthy (Scottsdale, Ariz.) and Silnore Tejero Sabando (Lapulapu City, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of power modules may include: a substrate having a first side and a second side. The power module may include a plurality of leads coupled to a second side of the substrate and a molding compound over a portion of five...