US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on April 21 for "Power module package with molded via and dual side press-fit pin" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,829, issued on April 21, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Power module package with molded via and dual side press-fit pin" was invented by Heejo Chi (Yeoju-si, South Korea), Seungwon Im (Bucheon, South Korea) and Oseob Jeon (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes an assembly of a semiconductor device die coupled to a lead frame. A board is disposed below the lead frame. The board includes a plated-through hole (PTH) aligned with an opening in the lead frame above the board. The module further includes a mold body encapsulating at least a portion of the assemb...