US Patent Issued to Semes on Sept. 15 for "Substrate treating apparatus and substrate treating method" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,736,979, issued on Sept. 15, was assigned to Semes Co. LTD. (Cheonan-si, South Korea).

"Substrate treating apparatus and substrate treating method" was invented by Se Won Kim (Suwon-si, South Korea), Chung Woo Lee (Suwon-si, South Korea) and Ji Won Cha (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The substrate treating apparatus includes an analysis part configured to communicate with a measurement unit to be input with an information with respect to a boundary, to calculate a center coordinate value of a substrate and a center coordinate value of a support unit with an input information on the boundary, to set a calculated ...