ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,773,855, issued on Oct. 27, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea).
"Substrate processing apparatus and method" was invented by Hyunjik Jung (Cheonan-si, South Korea) and Yong Won Kim (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate processing apparatus and method capable of preventing suction holes from being clogged due to airflow generated when a substrate is floated and printed, and the substrate processing apparatus includes a substrate stage for supporting a substrate, and a treatment liquid ejection device mounted above the substrate stage to eject a treatment liquid onto the...