ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,054, issued on June 30, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea).

"Substrate processing method and substrate processing system using the same" was invented by Solmin Park (Cheonan-si, South Korea), Hyunmin Lee (Anyang-si, South Korea), Junho Kim (Cheonan-si, South Korea) and Sujin Kim (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes determining a first impact of an ink droplet ejected toward a substrate moving at a first speed, determining a second impact of an ink droplet ejected toward the substrate moving at a second speed, determining a reference ejection speed ...