ALEXANDRIA, Va., June 16 -- United States Patent no. 12,658,408, issued on June 16, was assigned to Semes Co. LTD. (Cheonan-si, South Korea).
"Apparatus and method for treating substrate" was invented by Dae Hyun Kim (Seoul, South Korea) and Dong Beom Jang (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for treating a substrate is disclosed. The apparatus includes a radio frequency (RF) power source to apply an RF signal to excite a process gas to be in a plasma state. A supporting unit to support the substrate includes an edge ring to surround the substrate, a coupling ring disposed under the edge ring and including an electrode in the coupling ring, and an edge impedanc...