ALEXANDRIA, Va., July 14 -- United States Patent no. 12,679,125, issued on July 14, was assigned to Semes Co. Ltd. (Cheonan-si, South Korea).
"Method of processing substrate" was invented by Euihwan Kim (Daejeon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of processing a substrate, a test film having a first area and a second area adjacent to the first area is provided. A first jet value is obtained from a first test pattern formed by jetting a chemical solution through a plurality of nozzles onto the first area of the test film. The chemical solution is jetted onto a first substrate based on the first jet value. A second jet value is obtained from a second test pattern formed ...