ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,555,749, issued on Feb. 17, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea).
"Substrate treating method and substrate treating apparatus" was invented by Young Je Um (Busan, South Korea), Wan Jae Park (Hwaseong-si, South Korea), Dong-Hun Kim (Seoul, South Korea), Seong Gil Lee (Hwaseong-si, South Korea) and Ji Hoon Park (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The inventive concept provides a substrate treating method. The substrate treating method for treating a substrate at which thin films are stacked and a hole is formed thereon including treating the substrate using a first plasma including an ion, which...