US Patent Issued to SEKISUI KASEI on July 7 for "Hollow resin particles used in resin composition for semiconductor member" (Japanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,674,009, issued on July 7, was assigned to SEKISUI KASEI Co. LTD. (Osaka, Japan).

"Hollow resin particles used in resin composition for semiconductor member" was invented by Ryosuke Harada (Osaka, Japan) and Koichiro Okamoto (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided hollow resin particles used in a resin composition for semiconductor members, which can be used in a resin composition for semiconductor members to provide a semiconductor member capable of exerting excellent low dielectric properties. The hollow resin particles used in a resin composition for semiconductor members according to an embodiment of the present...