US Patent Issued to SEKISUI KASEI on July 7 for "Hollow resin particles, method for producing hollow resin particles, and use of hollow resin particles" (Japanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,674,008, issued on July 7, was assigned to SEKISUI KASEI Co. LTD. (Osaka, Japan).

"Hollow resin particles, method for producing hollow resin particles, and use of hollow resin particles" was invented by Haruhiko Matsuura (Osaka, Japan) and Shinya Matsuno (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a hollow resin particle that has a shell portion and a hollow portion surrounded by the shell portion and that can achieve reductions in dielectricity and dielectric loss tangent and can exhibit excellent heat resistance. In addition, a method for producing such a hollow resin particle in a simple manner is provided. Furthermore, us...