US Patent Issued to SEKISUI KASEI on July 21 for "Resin composition for solder resist, solder resist film, and circuit board" (Japanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,777, issued on July 21, was assigned to SEKISUI KASEI Co. LTD. (Osaka, Japan).

"Resin composition for solder resist, solder resist film, and circuit board" was invented by Koichiro Okamoto (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There are provided a resin composition for a solder resist, a solder resist film, and a circuit board that exhibit an excellent low dielectric property by a non-conventional new approach. A resin composition for a solder resist according to an embodiment of the present invention contains a thermosetting resin, an inorganic filler, and hollow resin particles, in which the hollow resin particles are contai...