ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,076, issued on March 24, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).
"Adhesive sheet and polishing pad with adhesive sheet" was invented by Yudai Ogata (Osaka, Japan), Kazuyuki Fukuyama (Shiga, Japan) and Tatsuya Kogiso (Shiga, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention aims to provide an adhesive sheet excellent in both shear strength and slurry resistance at high temperature and excellent in removability that enables removal without adhesive residue. The present invention also aims to provide a polishing pad with an adhesive sheet including the adhesive sheet. Provided is an adhesive sheet including a...