US Patent Issued to SEKISUI CHEMICAL on March 17 for "Heat conductive sheet and method for producing heat conductive sheet" (Japanese Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,624, issued on March 17, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).

"Heat conductive sheet and method for producing heat conductive sheet" was invented by Masayuki Matsushima (Tochigi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat conductive sheet having excellent adhesion between an acrylic resin layer and a supporting sheet is provided. The heat conductive sheet includes a heat conductive resin layer including a heat conductive acrylic resin composition; and a supporting resin layer (supporting sheet) containing a polyvinyl acetal resin and a styrene-vinyl isoprene block copolymer. Crosslinking of the supporting sheet...