US Patent Issued to SEKISUI CHEMICAL on June 16 for "Provisional fixation material and method for producing electronic component" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,334, issued on June 16, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).

"Provisional fixation material and method for producing electronic component" was invented by Izumi Daido (Osaka, Japan), Toshio Takahashi (Osaka, Japan), Tokushige Shichiri (Osaka, Japan), Satoshi Hayashi (Osaka, Japan) and Fumika Hoshino (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention aims to provide a temporary fixing material that is easily separable even after high-temperature processing at 300deg C. or higher with an adherend fixed thereon. The present invention also aims to provide a method for producing an electronic component...