US Patent Issued to SEKISUI CHEMICAL on April 21 for "Resin composition and heat-dissipating member" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,731, issued on April 21, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).

"Resin composition and heat-dissipating member" was invented by Masataka Sugimoto (Atsugi, Japan), Osamu Inui (Yao, Japan), Izumi Matsumoto (Kyoto, Japan), Tetsurou Yoshioka (Kyoto, Japan) and Abison Scaria (Takatsuki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a resin composition containing a resin component and diamond particles, the diamond particles having the total metal content constituted from iron, nickel, cobalt, and chromium of 5 ppm or higher and 300 ppm or lower."

The patent was filed on Oct. 22, 2020, under Application No. 17...