US Patent Issued to Seiko Epson on Sept. 8 for "Mold and injection molding device evaluation method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,728,573, issued on Sept. 8, was assigned to Seiko Epson Corp. (Tokyo).

"Mold and injection molding device evaluation method" was invented by Masayuki Takahashi (Shiojiri, Japan), Kakeru Sasagawa (Matsumoto, Japan) and Juri Yamaguchi (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A mold includes: a fixed mold; a movable mold facing the fixed mold; a first plate having a first opening into which the fixed mold is incorporated and fixing the fixed mold; and a second plate having a second opening into which the movable mold is incorporated and fixing the movable mold. The fixed mold and the movable mold define a cavity. The fixed mold and ...