ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,752,462, issued on Oct. 6, was assigned to Seiko Epson Corp. (Tokyo).
"Mold manufacturing method and mold" was invented by Tatsuya Tsuboi (Okaya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A mold manufacturing method used in an injection molding apparatus has a first step of shaping a laminated body that becomes a part of the mold by discharging molding material and stacking layers on a base plate having a first member with a first opening and a second member assembled into the first opening, a second step of removing the second member from the base plate on which at least a part of the laminated body has been shaped, and performing at least on...