US Patent Issued to Seiko Epson on March 24 for "Injection molding system" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,163, issued on March 24, was assigned to Seiko Epson Corp. (Tokyo).

"Injection molding system" was invented by Masashi Fuchii (Minowa-machi, Japan), Yimei Ding (Shiojiri, Japan), Naoki Iizuka (Shiojiri, Japan), Hidenobu Maruyama (Azumino, Japan), Kenta Anegawa (Matsumoto, Japan) and Yasuto Kanai (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An injection molding system includes a molding device, an inspection device configured to inspect a molded product and a control device that includes a storage unit, and a reception unit configured to receive a change content of a parameter included in a standard molding condition. The control...