US Patent Issued to Seiko Epson on March 17 for "Three-dimensional shaping system" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,590, issued on March 17, was assigned to Seiko Epson Corp. (Tokyo).

"Three-dimensional shaping system" was invented by Tatsuya Teramoto (Shiojiri, Japan) and Taki Hashimoto (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional shaping system includes: a dispensing unit including a plasticizing unit configured to plasticize a material to generate a plasticizing material and a nozzle configured to dispense the plasticizing material; a stage allowing the plasticizing material to be laminated; a moving unit configured to change a relative position between the nozzle and the stage; and a plate-shaped heating unit including ...