US Patent Issued to SEIKO EPSON on March 17 for "Plasticizing device, three dimensional molding device, and injection molding device" (Japanese Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,593, issued on March 17, was assigned to SEIKO EPSON Corp. (Japan).

"Plasticizing device, three dimensional molding device, and injection molding device" was invented by Masayuki Gozu (Ina, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plasticizing device includes a material storage section having a first input port and a second input port and storing plasticization material; a plasticizing section having a supply port to which the plasticization material is supplied and plasticizing at least part of the plasticization material to generate a molding material; a connecting pipe having a connecting path connecting the first and the second in...