US Patent Issued to SEIKO EPSON on July 28 for "Thixotropically molded product, thixotropic molding material, and method of producing thixotropic molding material" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,691,492, issued on July 28, was assigned to SEIKO EPSON Corp. (Japan).

"Thixotropically molded product, thixotropic molding material, and method of producing thixotropic molding material" was invented by Shunsuke Uchizono (Shiojiri, Japan), Yasutoshi Hideshima (Matsumoto, Japan), Setsuya Iwashita (Nirasaki, Japan), Fumiya Maeda (Matsumoto, Japan), Koichi Ozaki (Okayama, Japan) and Tadao Fukuta (Kurashiki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thixotropically molded product includes: a matrix portion containing Mg as a main component; a first particle portion dispersed in the matrix portion and containing SiC as a main component; a secon...