US Patent Issued to SEIKO EPSON on July 28 for "Thickness calculation method, calculation device, and program" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,690,836, issued on July 28, was assigned to SEIKO EPSON Corp. (Tokyo).

"Thickness calculation method, calculation device, and program" was invented by Kaori Yoda (Shiojiri, Japan), Ryoichi Shimura (Azumino, Japan) and Mio Sasaki (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thickness calculation method for calculating a thickness of a tissue in a living body by a computer, a processor of the computer performs acquiring received data based on a reception signal of an ultrasonic wave for a target living body, classifying the target living body into one of a first attribute and a second attribute based on the acquired received data, (i)...