US Patent Issued to SEIKO EPSON on July 21 for "Method for manufacturing device" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,391, issued on July 21, was assigned to SEIKO EPSON Corp. (Japan).

"Method for manufacturing device" was invented by Toshiki Kanai (Shiojiri, Japan), Kenichi Kurokawa (Suwa, Japan) and Yukio Yamauchi (Chino, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a device including an active layer and a support substrate bonded to the active layer on one surface side, the active layer including an element, an electrode configured to drive the element, a frame portion disposed around the element, and an electrode pad disposed in the frame portion and coupled to the electrode, the method including: forming a protective film at ...