ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,248, issued on Jan. 20, was assigned to Seiko Epson Corp. (Tokyo).
"Three-dimensional molding system" was invented by Takumi Tashiro (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional molding system includes: an ejection unit including a nozzle; a stage including a molding surface and on which the molding material is laminated; a position changing unit configured to change relative positions of the stage and the nozzle; a camera disposed outside an outer edge of the molding surface when viewed from a direction perpendicular to the molding surface, and at a position where the entire molding surface is imaged; a control ...