US Patent Issued to Seiko Epson on Feb. 17 for "Three-dimensional shaping device and method of manufacturing three-dimensional shaped object" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,101, issued on Feb. 17, was assigned to Seiko Epson Corp. (Tokyo).

"Three-dimensional shaping device and method of manufacturing three-dimensional shaped object" was invented by Masayuki Gozu (Ina, Japan), Taki Hashimoto (Shiojiri, Japan) and Kazuhide Nakamura (Asahi-mura, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional shaping device includes a plasticizing unit configured to plasticize a material to generate a plasticized material, a nozzle configured to discharge the plasticized material, a stage including a shaping surface on which the plasticized material is stacked, a moving unit configured to change relative positions...