US Patent Issued to SEIKO EPSON on Aug. 11 for "Injection molding device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,135, issued on Aug. 11, was assigned to SEIKO EPSON Corp. (Japan).

"Injection molding device" was invented by Masayuki Takahashi (Shiojiri, Japan), Kakeru Sasagawa (Matsumoto, Japan) and Ippei Honma (Shonai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An injection molding device includes a fixing section to which a molding die having a fixed molding die and a movable molding die, an injection section that injects a molding material, and a moving section that moves the injection section relative to the fixed molding die. The injection section includes a nozzle and an injection amount adjustment mechanism. The injection molding device further...