ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,564, issued on Oct. 20, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).
"Substrate processing method" was invented by Ichiro Mitsuyoshi (Kyoto, Japan), Tadashi Maegawa (Kyoto, Japan), Hidehiko Ozaki (Kyoto, Japan) and Nozomu Nakagawa (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method including: a disassembly process of disassembling a temporary batch lot by dividing substrates into a first set and a second set such that two substrates facing each other among substrates constituting the temporary batch lot form different sets and moving the first set and the second set relative to each other in a direc...