ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,447, issued on May 19, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).

"Substrate treatment method and substrate treatment device" was invented by Katsuya Akiyama (Kyoto, Japan) and Yukifumi Yoshida (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes a hydrophilic film forming liquid supplying step of supplying, toward a major surface of a substrate, a hydrophilic film forming liquid to form a hydrophilic film on the major surface, a film thickness reducing liquid supplying step of supplying, toward the major surface, a film thickness reducing liquid to reduce a thickness of the hydrophilic fil...