ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,891, issued on March 17, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).
"Substrate processing method, substrate processing device, and processing fluid" was invented by Yukifumi Yoshida (Kyoto, Japan) and Kana Tahara (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes a processing film forming step in which a processing liquid is supplied to a front surface of a substrate to solidify or cure the processing liquid on the front surface of the substrate, thereby forming a processing film on the front surface of the substrate, an etching component forming step in which the processing film is sub...