ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,013, issued on Aug. 11, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).

"Substrate processing method and substrate processing apparatus" was invented by Tsungju Lin (Kyoto, Japan) and Hiroaki Ishii (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a substrate processing method and a substrate processing apparatus. A substrate processing method includes: a rinsing liquid/brush cleaning step of moving a brush exerting force onto an upper surface of a substrate from a center of the substrate toward a perimeter of the substrate while causing a fixed nozzle to discharge a rinsing liquid onto the upper ...