ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,920, issued on Aug. 11, was assigned to SCREEN Holdings Co. Ltd. (Japan).
"Processing condition specifying method, substrate processing method, substrate product production method, computer program, storage medium, processing condition specifying device, and substrate processing apparatus" was invented by Dai Inagi (Kyoto, Japan), Tatsuya Shimano (Kyoto, Japan) and Takashi Ota (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A processing condition specifying method that includes Steps S31, S32, and S33. In Step S31, a prediction thickness information piece containing prediction values of thicknesses after processing on the substrate W is...